| 摘要 |
<p>A polishing apparatus is provided for removing material from a surface of a substrate. The apparatus includes a polishing head for positioning a surface of a substrate against polishing surface of the apparatus. The polishing head includes a subcarrier to hold the substrate during a polishing, and a retaining ring (210) having an inner edge disposed about the subcarrier and a lower surface in contact with the polishing surface during polishing, the lower surface of the ring having a number of radial recesses (215) formed therein to distribute a chemical between the substrate held on the subcarrier and the polishing surface when there is relative motion between the substrate and polishing surface. Preferably, the recesses comprise at least one groove to transport the chemical from an area near an outer edge of the ring to an area near an inner edge of the retaining ring. Preferably, the groove comprises a chevron shape between the outer and inner edge of the retaining ring.</p> |
