| 摘要 |
A package (1), comprising a function chip (2), a volumetric shrinkage material layer (8) formed on the surface of the function chip, and a sealing material (3), wherein the volume of the volumetric shrinkage material layer is reduced by, for example, heating, after the function chip and the volumetric shrinkage material layer are sealed with the sealing material, whereby a space (5) sealed with vacuum or gas is formed between the surface of the function chip and the volumetric shrinkage material layer. |
