发明名称 |
Cooling apparatus |
摘要 |
The device has a cooling plate and a distribution device for cooling fluid at a distance from the cooling plate with at least one cooling fluid takeoff opening. The distribution device has a first plate with outlet openings and uniformly distributed takeoff openings, a second plate and a third plate one above the other. Each two plates bound a feed channel connected to all outlet openings and a removal channel connected to all takeoff openings. The device has a thermally conductive cooling plate and a distribution device for cooling fluid at a distance from the cooling plate with at least one cooling fluid takeoff opening. The distribution device has a first plate (1) with outlet openings (9) and uniformly distributed takeoff openings (10), a second plate (2) and a third plate (3) one above the other with each two plates bounding a feed channel (13) connected to all outlet openings and a removal channel (12) connected to all takeoff openings. |
申请公布号 |
EP1331665(A1) |
申请公布日期 |
2003.07.30 |
申请号 |
EP20020001846 |
申请日期 |
2002.01.26 |
申请人 |
DANFOSS SILICON POWER GMBH |
发明人 |
EISELE, RONALD;OLESEN, KLAUS, KRISTEN |
分类号 |
F28F3/08;F28F13/02;H01L23/367;H01L23/473;H05K7/20;(IPC1-7):H01L23/473 |
主分类号 |
F28F3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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