| 摘要 |
PROBLEM TO BE SOLVED: To obtain a curable polyimide resin composition with which a polyimide cured resin film that is excellent in heat resistance, solvent resistance, mechanical characteristics, adhesiveness, or the like, can be formed, and which has low viscosity and good performance. SOLUTION: (A) in Formula (1). The curable polyimide composition comprises a polyamic acid (A) represented by formula I, an aromatic tetracarboxylic acid diester (B), an aromatic diamine (C), an aromatic polyamine of trifunctional or above (D), and an organic solvent (E). In formula (I), R<SP>1</SP>shows a 1-10C bivalent organic group, R<SP>2</SP>shows a 1-8C monovalent organic group, X shows a 1-200C quadrivalent organic group containing an aromatic ring or an aliphatic ring, and (m) is an integer of 1-200, and (n) is an integer of 2 or more. COPYRIGHT: (C)2003,JPO
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