| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting liquid sealing resin composition which is excellent in fracture toughness and gives a semiconductor device not allowing cracks to occur during its moisture absorption/reflow treatment and impact test. SOLUTION: This thermosetting liquid sealing resin composition essentially comprises (A) a thermosetting resin, (B) a curing agent, and (C) a filler and gives a cured item having a fracture toughness KI<SB>c</SB>at normal temperature of 2.4 MPa m<SP>1/2</SP>or higher. COPYRIGHT: (C)2003,JPO
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