| 摘要 |
PROBLEM TO BE SOLVED: To provide resin powder to be used for tablets for terminals used on a semiconductor package, that is, suitable for making such tablets alternative to conventional glass powder as to be low in energy consumption, cause no plating damage, be excellent in packing workability under compression molding, flowability in hot melting and adhesive strength, and develop no voids, and also compatible with miniaturizing such a semiconductor package. SOLUTION: The resin powder essentially comprises a thermosetting resin, a curing agent and a filler, being 75-355μm in particle size distribution; wherein the filler is 5-11μm in volume-average particle size and its compounding amount is 70-90 pts.wt. based on a total 100 pts.wt. of the thermosetting resin and the curing agent. The method for producing the resin powder by melt kneading grinding method is also provided. COPYRIGHT: (C)2003,JPO
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