| 摘要 |
PROBLEM TO BE SOLVED: To provide a new liquid resin composition for a semiconductor element with bumps which can maintain a stable B-stage state over a long time without detriment to its characteristics and can greatly improve the production process; and a novel assembling process using the composition. SOLUTION: This liquid sealing resin composition comprises an at least difunctional solid epoxy resin, a solid curing agent having a flux action, a cure accelerator, and a solvent which is a good solvent for the solid epoxy resin and is a poor solvent for the curing agent having a flux action. COPYRIGHT: (C)2003,JPO
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