| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing excellent in filling properties, continuous moldability, and soldering resistance. SOLUTION: This epoxy resin composition essentially contains (A) an epoxy resin containing 50-100 wt.% phenol aralkyl epoxy resin having a biphenylene backbone, (B) a phenol resin containing 50-100 wt.% phenol aralkyl resin having a biphenylene backbone, (C) a triphenylphosphine-benzoquinone adduct having a heat of crystal fusion of 3 (J/g) or lower, and (D) an inorganic filler. COPYRIGHT: (C)2003,JPO
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