| 发明名称 |
Electronic device |
| 摘要 |
<p>The device has a two-part housing for accommodating a carrier substrate (10) for an electronic circuit (11), and a first synthetic housing part (1) has an integrated synthetic plug body. The substrate is attached to a ribbed metal heat conducting device (5) mounted on the first housing part.</p> |
| 申请公布号 |
EP1006766(B1) |
申请公布日期 |
2003.07.30 |
| 申请号 |
EP19990123082 |
申请日期 |
1999.11.22 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
KROHN, THOMAS;ULLRICH, HORST |
| 分类号 |
H01L23/36;H01L23/40;H05K1/02;H05K5/00;H05K7/20;(IPC1-7):H05K5/00 |
主分类号 |
H01L23/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
