发明名称 LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a lead frame which does not embrittle by hydrogen when subjected to etching and a always has a high reliable function. SOLUTION: The lead frame consists of an alloy containing, by mass, 30 to 48% Ni, 0.005 to 1% of at least one kind selected from Nb Mo, V, W, Ti, Zr, Cr and B, 0.003 to 0.02% carbon,≤50 ppm oxygen, and≤10 ppm hydrogen, and the balance Fe with inevitable impurities. A part of at least one kind selected from Nb, Mo, V, W, Ti, Zr, Cr and B is made into carbide, or the contained concentration thereof in the surface side is increased. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003213375(A) 申请公布日期 2003.07.30
申请号 JP20020350193 申请日期 2002.12.02
申请人 TOSHIBA CORP 发明人 TEJIMA KOICHI;KAGAMI HIDEYO;INABA MICHIHIKO;NAKAMURA SHINICHI
分类号 C22C38/00;C22C19/03;C22C19/05;C22C38/54;H01L23/48;(IPC1-7):C22C38/00 主分类号 C22C38/00
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