发明名称 POLYAMIDE BASED RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To economically obtain a polyamide based molding having excellent impact resistance over a wide temperature range from a low temperature to a high temperature while maintaining excellent strength, rigidity, heat resistance, chemical resistance and moldability inherent in a polyamide based resin. SOLUTION: A polyamide based resin composition is characterized in that it contains (A) the polyamide based resin, (B) an inorganic reinforcing material, (C) a thermoplastic resin other than the polyamide based resin and (D) a mold release agent, that the inorganic reinforcing material (B) and the thermoplastic resin (C) do not directly contact with each other and are independently uniformly dispersed in a continuous phase comprising the polyamide based resin (A), that the diameter of the dispersed particles of the thermoplastic resin (C) is about 2μm or smaller, and that it has an Izod impact strength of 150 J/m or higher. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003213124(A) 申请公布日期 2003.07.30
申请号 JP20020011946 申请日期 2002.01.21
申请人 TOYOBO CO LTD 发明人 TAMURA TSUTOMU;NAKAGAWA TOMOHIDE
分类号 C08K3/00;C08K5/00;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08K3/00
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