| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having long pot life and good storage stability, and to provide a semiconductor device using the same. SOLUTION: This epoxy resin composition essentially comprises (A) an epoxy resin, (B) a phenolic resin, (C) a benzoxazine of the general formula [I] (R<SP>1</SP>is H or methyl; R<SP>2</SP>is a 1-3C alkyl or phenyl; and n is an integer of 0 or≥1), (D) an amine-based curing promoter and (E) an inorganic filler; wherein the equivalent ratio of the phenolic hydroxy groups in the component B to the epoxy groups in the component A is 1.5-4.0. COPYRIGHT: (C)2003,JPO
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