| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which, in molding in the step of sealing a semiconductor device, exhibits excellent mold release properties in continuous molding, hardly allows runner snapping or mold staining to occur, and gives a cure item excellent in reliability. SOLUTION: This epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) a mold release agent, (D) a copolymer of an alkenyl- group-containing epoxy compound and an organopolysiloxane represented by composition formula (2): H<SB>a</SB>R<SB>b</SB>SiO<SB>(4-a-b)/2</SB>, and (E) an inoragnic filler. The mold release agent (C comprises (a) a wax represented by formula (1) (wherein R<SP>1</SP>is an 18-40C monovalent hydrocarbon group; and R<SP>2</SP>is H or R<SP>1</SP>-CO-) and (b) a polyethylene wax having an acid value of 15-28. COPYRIGHT: (C)2003,JPO
|
