| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device for optical communication which enables accurate optical communication with high reliability in transmitting an optical signal, since the optical signal transmitted in an optical path for optical signal transmission is hardly attenuated or is hardly absorbed in a wall surface, when the signal is reflected by the wall of the optical path, and therefore, the loss of the optical signal hardly occurs, and is small-sized by integrating optical parts and electronic parts required for optical communication into one body. <P>SOLUTION: The device for optical communication comprises an IC chip mounting substrate and a multi-layered printed wiring board, and the optical path for optical signal transmission penetrating the IC chip mounting substrate is arranged in the IC chip mounting substrate, and the optical path for optical signal transmission has a glossy metallic layer formed on a part or the whole of the wall surface. <P>COPYRIGHT: (C)2003,JPO</p> |
