| 摘要 |
PROBLEM TO BE SOLVED: To provide a high thermoconductive alloy having a thermal expansion coefficient close to that of glass and a heat sink having increased heat dissipation amount, and to provide methods for manufacturing them. SOLUTION: The high thermoconductive alloy 1 of≥250 W/mK thermal conductivity is composed of a tungsten-copper alloy prepared by dispersing tungsten particles of 0.2 to 2μm particle size in a copper matrix and sintering. The heat sink is prepared by forming the alloy 1 into desired shape. The high thermoconductive alloy 1 and the heat sink constituted of the alloy 1 can be obtained from tungsten/copper composite capsules as a raw material, in which tungsten powder is adhered to the surface of copper powder by coating and copper content is regulated to≥30 wt.% and applying heating at a temperature in the vicinity of the melting point of copper in a hydrogen atmosphere for sintering by a metal injection molding method. COPYRIGHT: (C)2003,JPO
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