发明名称 ELECTROLESS PLATING METHOD FOR WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an electroless plating method for preventing a defect in bending of a flexible wiring board, unevenness of plating in the wiring board, and failures such as the decomposition of a plating solution, and to provide a wiring board which has excellent reliability in the connection of via holes. SOLUTION: In the method of applying electroless plating to a wiring board, the electroplating is performed by using a magnet fixing type fixture for the fixing of the wiring board. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003213439(A) 申请公布日期 2003.07.30
申请号 JP20020007540 申请日期 2002.01.16
申请人 HITACHI CHEM CO LTD 发明人 HIROYAMA YUKIHISA;TAKAHASHI KENICHI;KAWASAKI RYOJI;TSUBOMATSU YOSHIAKI;TSUYAMA KOICHI
分类号 C23C18/31;H01L23/12;(IPC1-7):C23C18/31 主分类号 C23C18/31
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