| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress variance due to the bonding state of two substrates stuck to each other by eliminating the relief of a substrate to be pressurized. <P>SOLUTION: In a process of cutting out a plurality of respective panels from a pair of substrates 1 and 2 stuck to each other via a seal material 6, a cut 3 is formed at the surface of one substrate 1 and in the case of applying pressure to a site corresponding to the cut 3 on the other substrate 2, the substrate is pressed by a surface in contact with the surface of the other substrate 2. The part of the substrate except for a range of 2 mm to 3 mm from the cut is pressed by a surface in contact with the surface of the substrate. Thus, in front and rear of a site on the other substrate 2 applying pressure to the cut 3, a surface in contact with the surface of the other substrate 2 is arranged and the substrate is pressed by pressing the substrate, thereby eliminating the relief of the substrate for applying pressure to the part of the cut and realizing stable cutting. <P>COPYRIGHT: (C)2003,JPO</p> |
