发明名称 METHOD OF FORMING Re FILM BY ELECTROPLATING
摘要 PROBLEM TO BE SOLVED: To provide an Re film which is used, e.g. for a corrosion resistant alloy film for a high temperature apparatus member such as a turbine blade by aqueous solution electroplating. SOLUTION: A plating bath consisting of an aqueous solution containing perrheate ions of 0.1 to 8.0 mol/l, and at least one kind selected from nickel ions, iron ions, cobalt ions, and chromium (III) ions of 0.005 to 2.0 mol/l in total, and at least one kind selected from lithium ions and sodium ions of 0.0001 to 5.0 mol/l in total, and in which the concentration of at least one kind of organic acid selected from carboxylic acid, hydroxycaroxylic acid, and amino acid is >5.0 to 15.0 equivalent weight to the total metallic ion concentration, and whose pH is controlled to 0 to 8, and solution temperature to 10 to 80°C is used. The atomic composition of the film can consist of≥98% Re. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003213480(A) 申请公布日期 2003.07.30
申请号 JP20020010811 申请日期 2002.01.18
申请人 JAPAN SCIENCE & TECHNOLOGY CORP;EBARA CORP;SAPPORO ELECTRO PLATING KOGYO KK 发明人 NARITA TOSHIO;HAYASHI SHIGENARI;YOSHIOKA TAKAYUKI;YAKUWA HIROSHI;SOMA MICHIAKI
分类号 F01D5/28;C25D3/54;C25D3/56;F02C7/00;(IPC1-7):C25D3/54 主分类号 F01D5/28
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