发明名称 |
Planarizers for spin etch planarization of electronic components |
摘要 |
An electronic component contemplated comprises a) a substrate layer, b) a dielectric layer coupled to the substrate layer, c) a barrier layer coupled to the dielectric layer, d) a conductive layer coupled to the barrier layer, and e) a protective layer coupled to the conductive layer. The electronic component contemplated herein can be produced by a) providing a substrate; b) coupling a dielectric layer to the substrate; c) coupling a barrier layer to the dielectric layer; d) coupling a conductive layer to the barrier layer; and e) coupling a protective layer to the conductive layer. The protective layer may then be cured to a desirable hardness. A method of planarizing a conductive surface of an electronic component may comprise a) introducing or coupling a protective layer onto a conductive layer; b) dispersing the protective layer across the conductive layer; c) curing the protective layer; d) introducing an etching solution onto the conductive layer; and e) etching the conductive surface to substantial planarity.
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申请公布号 |
US6600229(B2) |
申请公布日期 |
2003.07.29 |
申请号 |
US20010847766 |
申请日期 |
2001.05.01 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
MUKHERJEE SHYAMA;LEVERT JOSEPH;DEBEAR DONALD |
分类号 |
C23F1/02;C23F1/18;C23F3/06;H01L21/306;H01L21/321;H01L21/3213;H01L21/768;H01L23/532;(IPC1-7):H01L23/48 |
主分类号 |
C23F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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