| 摘要 |
A flip chip is mounted on a printed circuit board, and bump electrodes and pads are established in electrical connection, wherein sealing resin between the flip chip and the printed circuit board is thermally cured for pressing the bump electrodes against the pads and, thereafter, the bump electrodes are alloyed with the pads so that not only the force but also the alloyed portion keep the electrical connection low in contact resistance without disconnection.
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