发明名称 Method of connecting circuit boards
摘要 The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another.
申请公布号 US6598780(B2) 申请公布日期 2003.07.29
申请号 US20000740264 申请日期 2000.12.20
申请人 DENSO CORPORATION 发明人 MIYAKE TOSHIHIRO;SHIGEMATSU KOICHI;SANADA KAZUYA;ISHIHARA HIDEHARU;YAZAKI YOSHITARO
分类号 B23K20/16;H01B1/22;H05K1/09;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):B23K31/02 主分类号 B23K20/16
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