发明名称 |
Method of connecting circuit boards |
摘要 |
The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another.
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申请公布号 |
US6598780(B2) |
申请公布日期 |
2003.07.29 |
申请号 |
US20000740264 |
申请日期 |
2000.12.20 |
申请人 |
DENSO CORPORATION |
发明人 |
MIYAKE TOSHIHIRO;SHIGEMATSU KOICHI;SANADA KAZUYA;ISHIHARA HIDEHARU;YAZAKI YOSHITARO |
分类号 |
B23K20/16;H01B1/22;H05K1/09;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):B23K31/02 |
主分类号 |
B23K20/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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