Method and device for measuring a temperature in an electronic component

摘要

The invention relates to a method for measuring the junction temperature in an electronic component. A periodic test signal is led via a signal path inside the component in order to obtain an internal signal. There is a frequency and/or phase relationship between the periodic test signal and a periodic external signal. A phase shift is measured between the internal signal and the external signal. The junction temperature is determined over the component region determined by the signal path as a function of the phase shift.