发明名称 |
GLASS CLOTH FORMED WITH CONDUCTOR PATTERN, PREPREG AND MULTILAYER BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a glass cloth suitable for a core base for a multilayer printed circuit board capable of more simply forming the multilayer printed circuit board as compared with prior art, and to provide a prepreg using the same and the multilayer printed circuit board. SOLUTION: The glass cloth comprises the conductor pattern formed on a surface thereof so that the pattern is formed of a conductive paste. The glass cloth is formed of a film resin of 0.1 to less than 40.0 wt.% so that an interior of glass yarn bundle for constituting the glass cloth is impregnated with the resin, and the resin for forming the film of the glass cloth is a thermosetting resin or a thermoplastic resin having a softening point of 40°C or higher or a mixture of the resin. COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003211568(A) |
申请公布日期 |
2003.07.29 |
申请号 |
JP20020012458 |
申请日期 |
2002.01.22 |
申请人 |
ASAHI SCHWEBEL CO LTD |
发明人 |
KIMURA YASUYUKI;GONDO YOSHINOBU |
分类号 |
B32B5/02;D03D15/12;H05K1/03;H05K3/46;(IPC1-7):B32B5/02 |
主分类号 |
B32B5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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