发明名称 |
Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof |
摘要 |
Copper foil lands provided with a through-hole filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands normally occurs to obtain a copper-plated through-hole in both sides of a printed wiring board using a paper-phenol substrate, wherein adhesion strength between the copper foil lands and the copper paste is enhanced.
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申请公布号 |
US6599617(B2) |
申请公布日期 |
2003.07.29 |
申请号 |
US20010891841 |
申请日期 |
2001.06.26 |
申请人 |
SONY CORPORATION |
发明人 |
MATSUDA YOSHINARI |
分类号 |
H05K3/42;H05K1/02;H05K1/11;H05K3/38;H05K3/40;(IPC1-7):B32B3/00 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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