发明名称 LASER BEAM MACHINING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device in which a machining speed is increased without dividing the power of a laser beam. <P>SOLUTION: A holding base 42 holds an object to be machined 45. A plurality of condenser lenses which condense an incident laser beam and make the condensed laser beam incident on the object to be machined are arranged. A laser light source 1 emits the laser beam 2. A dividing device makes the laser beam emitted from the laser light source incident on some of condenser lenses which are selected from the plurality of condenser lenses. The condenser lens on which the laser light is made incident is changed by varying the advancing direction of the laser beam at a dividing point. The optical path between the dividing point and the condenser lens varies depending on the condenser lenses. A field lens 15 is arranged on the path of the laser beam between the laser light source and the dividing point. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003211278(A) 申请公布日期 2003.07.29
申请号 JP20020012831 申请日期 2002.01.22
申请人 SUMITOMO HEAVY IND LTD 发明人 ISO KEIJI;KOBAYASHI IZUSHI
分类号 B23K26/06;(IPC1-7):B23K26/06 主分类号 B23K26/06
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