发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing method that can maintain an optimum polishing state by maintaining moisture in abrasives to a prescribed quantity. SOLUTION: This polishing method is provided with the abrasives 4 containing a prescribed quantity of moisture; a jet rotor 3 for jetting the abrasives 4 to collide with a polished material 2; a belt conveyor 5 and an abrasive guide 6 for supplying the abrasives 4 to the jet rotor 3; and a moisture supply means 9 for supplying moisture to the abrasives 4. A large number of abrasives 4 containing the prescribed quantity of moisture are jetted to collide with the polished material to polish the surface of the polished material 2. In the case of repeatedly using the abrasives 4 for polishing, moisture is supplied to the abrasives 4 from the moisture supply means 8 so that the quantity of moisture in the abrasives 4 is maintained to the prescribed quantity. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003211359(A) 申请公布日期 2003.07.29
申请号 JP20020010328 申请日期 2002.01.18
申请人 TECTORIA:KK;YAMASHITA WORKS:KK 发明人 TAKAGI TOSHIMASA;YAMASHITA KENJI
分类号 B24C9/00;B24C7/00;(IPC1-7):B24C9/00 主分类号 B24C9/00
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