| 摘要 |
A method is disclosed for avoiding oxidation of a bonding pad served as an electrical connection to devices mounted on a transparent insulating substrate of a thin-film transistor applied to an organic light emitting diode (OLED). Firstly, the bonding pads are defined on the transparent insulating substrate. Then, an ITO defending layer and an indium tin oxide (ITO) anode are defined simultaneously on the bonding pads and partial of the transparent insulating substrate surface, respectively. The ITO defending layer described above is provided to prevent the bonding pad from being oxidized. The oxidation upon the bonding pad is reduced, so that the conductivity thereof can be ensured.
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