发明名称 Method of fabricating conductive straps to interconnect contacts to corresponding digit lines by employing an angled sidewall implant and semiconductor devices fabricated thereby
摘要 A method for interconnecting bit contacts and digit lines of a semiconductor device. A mask, through which portions of sidewall spacers of the digit lines located proximate the bit contacts are exposed, is positioned over the digit lines. Dopant is directed toward the semiconductor device at a nonperpendicular angle to a plane of the semiconductor device so as to dope portions of the sidewall spacers on one side of each of the digit lines while sidewall spacers opposed thereto and adjacent bit contacts are shielded from the dopant. Doped regions of the sidewall spacers may be removed with selectivity over undoped regions thereof to expose connect regions of each conductive element of each digit line. A conductive strap may then be formed to electrically link each connect region to its corresponding bit contact. Semiconductor devices including the conductive straps are also disclosed.
申请公布号 US6600191(B2) 申请公布日期 2003.07.29
申请号 US20020137552 申请日期 2002.05.02
申请人 MICRON TECHNOLOGY, INC. 发明人 LOWREY TYLER A.;BATRA SHUBNEESH
分类号 H01L21/768;H01L21/8242;H01L21/8246;H01L27/108;(IPC1-7):H01L29/72 主分类号 H01L21/768
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