MANUFACTURING METHOD FOR SILICON SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a silicon substrate capable of manufacturing a large-diameter silicon thin substrate from an ingot by a slicing method using a saw wire at high product yield without any cutting trouble. SOLUTION: This manufacturing method for the silicon substrate produces the silicon substrate by simultaneously and parallel cutting a plurality of positions of silicon ingot 1 bonded to a fixing plate 2 with adhesives 3, by the saw wire 5 and abrasive grains 14. The fixing plate used has a transverse intensity of 50 N/mm2and the adhesives having an adhesive strength of 2500 N/cm2or more is formed into a layer thickness of the wire diameter or less of the saw wire. COPYRIGHT: (C)2003,JPO