Flip-chip semiconductor package structure and process for fabricating the same

摘要

An advanced flip-chip packaging technology is proposed, which is characterized in the forming of a metal dam over the substrate to serve three different utilization purposes. First, the metal dam can help provide a specific fillet width to the underfilled material under the flip chip so as to allow the joint between the flip chip and the substrate to have increased robustness against thermal stress. Second, the metal dam can serve as a mechanical reinforcement to the substrate to prevent package warpage. Third, the metal dam can additionally serve as a heat-dissipation structure to help the heat dissipation from the flip chip. These benefits allow the finished package product to be highly assured in quality and reliability.