| 摘要 |
PURPOSE: An apparatus for pressurizing a lid of an electronic component package is provided to reduce fabricating cost and precisely control the temperature and pressure for attaching the lid to a substrate by pressurizing the substrate and the lid while using liquid of high specific gravity. CONSTITUTION: A table(120) on which the substrate is placed is installed in a lower portion of a main body(110). The liquid of a high specific gravity is stored in the first store unit closely installed in the main body. A pressurizing plate(130) forms the first store unit, closely coupled to the inner circumferential surface of the main body and capable of moving up/down. The pressurizing plate pressurizes the lid placed on the substrate toward the substrate while moving down according to the quantity of the liquid stored in the first store unit. An elastic member(140) restores the pressurizing plate to its initial state, prepared between the pressurizing plate and the table. The liquid is stored in the second store unit, closely installed in the main body and connected to the first store unit. A heating unit(150) heats the liquid stored in the second store unit, prepared in the main body. A supply plate(160) forms the second store unit and makes the liquid stored in the second store unit supplied to the first store unit, closely coupled to the inner circumferential surface of the main body and capable of moving up/down. A motor(170) increases or decreases the supply plate, prepared at a side of the main body.
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