发明名称 MECHANISM FOR CLAMPING DEVICE INTERFACE BOARD TO PERIPHERAL
摘要 A mechanism for attaching a device interface board (DIB) to a surface of a test head or peripheral includes first and second pulldown mechanisms attached to the surface and a substantially U-shaped actuator. Each of the pulldown mechanisms includes a rotating member coupled to a connecting member via a translation interface. The translation interface converts rotation of the rotating member into vertical movement of the connecting member. The U-shaped actuator has first and second ends respectively coupled to the rotating members of the first and second pulldown mechanisms. Swinging the U-shaped actuator through an arc rotates the rotating members and causes the connecting members to move vertically. A DIB that latches with the connecting members can thus be pulled down against the surface quickly and conveniently, with sufficient mechanical leverage for compressing large numbers of spring-loaded pins.
申请公布号 KR20030063399(A) 申请公布日期 2003.07.28
申请号 KR20037007252 申请日期 2003.05.29
申请人 发明人
分类号 G01R31/28;H01L21/66;G01R1/073 主分类号 G01R31/28
代理机构 代理人
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