PACKAGE FILM INCLUDING SLIT FOR DISTRIBUTING STRESS

摘要

PURPOSE: A package film including a slit for distributing stress is provided to maximize an area of the film occupied by a package by forming a slit with a small area on the film so that the stress generated in forming the package is eliminated. CONSTITUTION: Sprocket holes of a predetermined width are widthwise formed at both edges of the package film(21) at regular intervals. A plurality of patterns(23) are formed in the circumference of a semiconductor chip mount region in the center of a width direction. Two circular holes and slits(24) composed of incision lines connecting the circular holes are formed between the sprocket holes and between the plurality of patterns.