| 摘要 |
PURPOSE: A plating apparatus having a plurality of power supplies is provided to prevent loss of plating metal (precious metal) due to excessive plating except required portion during plating and reduce time and cost greatly by shortening plating time, and a plating method using the plating apparatus is provided. CONSTITUTION: In a plating apparatus comprising a plating tank(110) in which an electrolyte(115) is contained, a pair of main anodes(120,120') at which a plating metal(140) such as silver or nickel is hooked so that the plating metal(140) is mounted on the pair of main anodes(120,120'), a cathode(130) at which a plating object (article) to be plated is hooked so that the plating object (article) is fixed to the cathode(130), subsidiary anodes(170) installed adjacent to the inner part of the plating object(160) hooked at the cathode(130), and a power supply for supplying an electric power to the main anodes(120,120') and subsidiary anodes(170), the plating apparatus having a plurality of power supplies is characterized in that the plating apparatus comprises at least two or more power supplies(100.200,...,n) and a plurality of subsidiary anodes, and a basic first power supply(100) is connected to the main anodes and cathode while the rest of other plurality of power supplies(200,...,n) are connected to a plurality of subsidiary anodes(170) and cathode.
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