| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed board of good conductivity for forming a circuit pattern of a high density and turning a conductor layer formed inside a via hole and a through-hole to a sufficient thickness. SOLUTION: The manufacturing method comprises a process of successively forming an inner layer circuit pattern 2 in a prescribed shape and an insulation layer 3 on an insulation substrate 1, a process of forming the via hole 4 at the insulation layer 3 so as to expose the inner layer circuit pattern 2 and the through-hole 5 passing through the insulation layer 3 and the insulation substrate 1, a process of forming a copper layer 6 inside the via hole 4, on the insulation layer 3 and inside the through-hole 5, a process of forming a masking material 7 covering the via hole 4 and the through-hole 5 on the copper layer 6, a process of thinning the copper layer 6 unmasked with the masking material 7 by etching and turning it to a prescribed thickness, and a process of removing the masking material 7 and then grinding the copper layer 6 at a part covered with the masking material 7 to the prescribed thickness. COPYRIGHT: (C)2003,JPO |
