SEMICONDUCTOR UNIT, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor unit the amount of warpage, weight and thickness of which can be reduced compared to a conventional one. SOLUTION: A semiconductor unit 40 comprises; a bare chip mounting copper foil plate 20 and a stacking copper foil plate 24 that are originally to be provided on an organic member 11 as a printed board 14; and an interlayer section 30 that is selected so that its thickness is almost the same as that of a bare chip 23 and inserted between a surface 20A of the bare chip mounting copper foil plate 20 and a surface 24A of the stacking copper foil plate 24, and that covers the bare chip 23 mounted onto the surface 20A of the bare chip mounting copper foil plate 20 and that is formed by integrally connecting the bare chip mounting copper foil plate 20 and the stacking copper foil plate 24 as heat is applied. The thickness of the semiconductor unit 40 can be reduced compared to the case where the semiconductor unit is made up of the printed board 14 by the thickness of the organic member 11. The amount of warpage is reduced regardless of the thickness of the interlayer section 30 because the coefficients of the thermal expansion of the bare chip mounting copper foil plate 20 and the stacking copper foil plate 40 are almost equal to that of the bare chip 23. COPYRIGHT: (C)2003,JPO