| 摘要 |
PROBLEM TO BE SOLVED: To provide a new substrate for wiring boards having improved heat conductivity (heat dissipation property). SOLUTION: The substrate for wiring boards comprises a carbonaceous substrate 10, an insulating electrolytic deposition layer 20 that is formed in the carbonaceous substrate 10 while an inorganic filler 201 is being diffused to polyimide 202 due to electrolytic deposition, and a metal layer 30 that is provided on the insulating electrolytic deposition layer 20. As the inorganic filler 201, aluminum nitride, silicon nitride, alumina, boron nitride, and the like are adopted. COPYRIGHT: (C)2003,JPO
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