| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for predicting stress distribution and a device for simulating the stress distribution capable of predicting the stress distribution in micro-regions, even when structures are constructed by metal, in the method for predicting the stress distribution for predicting the stress distribution applied to the structures formed on a substrate and the device for simulating the stress distribution used in the method for predicting the stress distribution. SOLUTION: A wafer-like silicon substrate 1 is provided, a base 2 is provided on the silicon substrate 1, a support 3 is provided so that it is erected from the base 2, and a cantilever 4 is provided on the support 3. Shape of the support 3 is a square pole, and the shape of the cantilever 4 is a rectangular parallelepiped. The cantilever 4 is supported like the cantilever by the support 3. Measuring elements 5 consisting of the bases 2, the supports 3, and the cantilevers 4 are provided on the silicon substrate like a matrix. COPYRIGHT: (C)2003,JPO
|
