| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board which is thinner and lighter by reducing total number of the printed wiring boards, and to provide its manufacturing method. <P>SOLUTION: In the printed wiring board having an inductor formed by via which electrically connects the up-and-down wirings on both sides of an insulating layer, a section in which the inductor exists and its periphery section are composed by different resins, and its manufacturing method consists of (a) a process to form a second insulating layer on a first insulating layer forming a lower wiring to be the inductor, (b) a process to expose the lower wiring by forming a groove with laser in the second insulating layer of a section to be the inductor, (c) a process to mount insulating resin including a magnetic material in a bored section, (d) a process to grind and flatten a surface, (e) a process to form the via with the laser and (f) a process to form an upper wiring and to electrically connect the upper wiring with the lower wiring at the via. <P>COPYRIGHT: (C)2003,JPO</p> |
