| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring module board with a built-in component for improving the component mounting density of a high density multilayer wiring board, and the manufacturing method. <P>SOLUTION: A conductor layer 21 is formed by sticking a copper foil on both surfaces of an insulation base material 11 and the through-hole 31 of the same diameter as the outer diameter of the component 40 is formed at the insulation base material 11 and the conductor layer 21. The component 40 for which electrodes 41 are formed at both ends is inserted to the through-hole 31 and the electrodes 41 at both ends are caulked. The conductor layer 21 is patterned and a first wiring layer 21a and a first wiring layer 21b electrically connected to the component 40 are formed. An insulation layer 51 is formed and an opening part is formed at a prescribed position of the insulation layer 41. A thin film conductor layer is formed on the insulation layer 51 and on the inner wall of the opening part and the component 40 is inserted to the opening part. The conductor layer 62 is formed and patterned to form a second wiring layer 62a and a second wiring layer 62b, and the multilayer wiring module board with the built-in component 40 in four layers is obtained. <P>COPYRIGHT: (C)2003,JPO</p> |
