RESIN-FILLED TYPE OPTICAL WAVEGUIDE DEVICE

摘要

PROBLEM TO BE SOLVED: To realize a package structure with high mass-productivity by which the cost is reducible and high reliability is obtained. SOLUTION: An optical waveguide element part 14 where an optical waveguide substrate 10 which has an optical circuit formed on a substrate and an optical fiber array 12 formed by arraying and fixing one or more optical fibers 18 are bonded and fixed while having their optical axes aligned is stored in a package 20. At least the optical waveguide substrate is not in contact with the package and a gel resin 24 is charged in the gap part between the optical waveguide element part and the package, so that the optical waveguide element part is held while surrounded with the gel resin nearly entirely. COPYRIGHT: (C)2003,JPO