发明名称 METHOD OF MANUFACTURING CONDUCTIVE-PATTERN FORMING BODY
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a conductive pattern which forms a highly fine pattern in a simple process and has no waste liquid disposal problems. SOLUTION: The method of forming the conductive pattern comprises the steps of: preparing a substrate for a pattern forming body which has a layer containing a photocatalyst and a binder on a base material, wherein the wettability of an energy-radiated region of the layer containing the photocatalyst varies in a direction to decrease the liquid contact angle; forming a wetting pattern comprising a lyophobic and a lyophilic regions on the layer containing the photocatalyst by radiating energy to a pattern shape on the layer containing the photocatalyst; adhering a metallic colloidal solution only to the lyophilic region by coating the metallic colloidal solution on the layer surface with the wetting pattern formed thereon; and forming the conductive pattern by solidifying the metallic colloidal solution attached to the lyophilic region. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003209339(A) 申请公布日期 2003.07.25
申请号 JP20020249604 申请日期 2002.08.28
申请人 DAINIPPON PRINTING CO LTD 发明人 KOBAYASHI HIRONORI
分类号 G03F7/20;C23C18/12;H05K3/10;H05K3/12;(IPC1-7):H05K3/10 主分类号 G03F7/20
代理机构 代理人
主权项
地址