发明名称 |
METHOD OF MANUFACTURING CONDUCTIVE-PATTERN FORMING BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a conductive pattern which forms a highly fine pattern in a simple process and has no waste liquid disposal problems. SOLUTION: The method of forming the conductive pattern comprises the steps of: preparing a substrate for a pattern forming body which has a layer containing a photocatalyst and a binder on a base material, wherein the wettability of an energy-radiated region of the layer containing the photocatalyst varies in a direction to decrease the liquid contact angle; forming a wetting pattern comprising a lyophobic and a lyophilic regions on the layer containing the photocatalyst by radiating energy to a pattern shape on the layer containing the photocatalyst; adhering a metallic colloidal solution only to the lyophilic region by coating the metallic colloidal solution on the layer surface with the wetting pattern formed thereon; and forming the conductive pattern by solidifying the metallic colloidal solution attached to the lyophilic region. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003209339(A) |
申请公布日期 |
2003.07.25 |
申请号 |
JP20020249604 |
申请日期 |
2002.08.28 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
KOBAYASHI HIRONORI |
分类号 |
G03F7/20;C23C18/12;H05K3/10;H05K3/12;(IPC1-7):H05K3/10 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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