| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device mounted board and the board mounting method of the electronic device capable of making thin a board circuit on which the device whose sealing is necessary is mounted, and sealing even the multi-pin device without any trouble, and easily conducting its wiring connection with the board. SOLUTION: In this electronic device mounted board and the board mounting method of the electronic device, a device whose sealing is necessary is directly mounted on the board, and it is covered with a bottomless case so that the peripheral contract part of the board and the case can be sealed, and that the electronic device mounted board can be made by for the thickness of the bottom of the conventional case. As for a signal line to the device, the device terminal is connected to lead wiring on the board, and any through-hole is not formed in the board region mounted with the device, and covered with the case to ensure the sealing function. Then, when this device is provided with a plurality of signal input/output terminals, the board is formed so as to be multi-layered so that those terminals can be distributed and connected to lead wiring on each board, and that the wiring efficiency of multi-pins can be improved. COPYRIGHT: (C)2003,JPO
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