| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer, a method for inspecting the semiconductor wafer and a method for manufacturing the semiconductor device in which inspection and aging can be performed by a simple and low-cost technique. SOLUTION: A plurality of chip areas 20 having a plurality of signal lines 1 with the same circuit configurations are formed to be arrayed in one semiconductor wafer, and scribe lines 40 of given widths which serve as cutting seams when scribing is formed between the neighboring chip areas 20. Common signal wires 2A, 2B, etc., are provided within widths of the scribe lines 40 so as to electrically be connected in common to each of the signal lines 1 of the same kinds of the plurality of chip areas 20. COPYRIGHT: (C)2003,JPO
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