SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing apparatus which can form a high quality film in a highly cleaned atmosphere and can improve the uniformity of film thickness. SOLUTION: A boat 30 to mount a plurality of semiconductor wafers (not illustrated) by laminating them is provided in an outer tube 10. A conic portion 13 is provided between a flange 14 and a body 12 to mount the outer tube 10 to a manihold 40. The internal diameter of the body 12 is reduced to make short the distance to the boat 30 for holding the wafer. Consequently, the uniformity of dopant concentration and uniformity of film thickness can be improved. Contamination from the lower part of a reaction furnace into a furnace can be prevented by providing a nozzle 21 to introduce raw material gas to the boat 30 between the outer tube 10 and the boat 30, and then controlling reaction gas to flow into the outer tube 10 from the upper side to the lower side. COPYRIGHT: (C)2003,JPO