| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing soldering failure of solder balls and improving the reliability of soldering, and to provide a method for mounting the semiconductor onto a wiring board. <P>SOLUTION: A semiconductor package 100 comprises a semiconductor chip 102 and a tape carrier 104 for mounting the semiconductor chip 102. The tape carrier 104 comprises a plurality of via holes 118 that penetrate from its top side through the bottom side and a solder ball 114 is attached to each via hole 118 as an external connection terminal. By adjusting the inner diameter Dv of the via hole 118 and the thickness t of the tape carrier 104 so that formula (1); Dv-3.75×t+0.095>0 holds, it is possible to reduce soldering failure of the solder ball 114 and improve the reliability of soldering. <P>COPYRIGHT: (C)2003,JPO |
