| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer treatment device capable of effecting one series of treatment of resist coating/baking/exposure (UV cure) in a short period of time. SOLUTION: The semiconductor wafer treatment device is equipped with a stage 21, a resist coating unit 1 fixed to the stage 21 to apply a resist 3 on the surfaces of semiconductor wafers 11a, 11b, etc., 11k, etc., a baking unit 8 fixed to the stage 21 adjacent to the resist coating unit 1 to bake the semiconductor wafers 11a, 11b, etc., 11k, etc., an exposure unit moving mechanism (not shown in a figure) fixed to the stage 21, and an exposure unit 5 driven by the exposure unit moving mechanism so as to be moved on the baking unit 8 and irradiating (exposing) the resist 3 on the semiconductor wafers 11a, 11b, etc., 11k, etc., by ultraviolet rays to cure them. COPYRIGHT: (C)2003,JPO |
