| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device and a substrate treatment method capable of continuing the treatment of a substrate when a trouble occurs in an inspection device and a measuring device. SOLUTION: A resist coating/developing system 1 comprises a cassette station 11, a treatment station 13 and an inspection station 12. The inspection station 12 has, for example, a defect inspection unit (ADI), a dummy inspection unit (DMM-A), a bypass inspection unit (BMM-A), and a main wafer conveyor 31. In the case that the sampling inspection of a wafer W is carried out, when the defect inspection unit (ADI) is broken down, inspection wafers W are mounted on the bypass inspection unit (BMM-A), and the remaining wafers excluding the inspection wafers W are mounted on the dummy inspection unit (DMM-A) in accordance with the order conveyed to the inspection station 12. Then, the wafers W are conveyed out to the cassette station 11 in the order conveyed in to the inspection station 12. COPYRIGHT: (C)2003,JPO |
