SEMICONDUCTOR DEVICE SINGLE-CHIP PUNCHING MACHINE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device single-chip punching machine that is inexpensive and easy-to-operate and capable of taking out a single-chip semiconductor device successively without damaging or depositing contamination on the surface of the product. SOLUTION: A frame-shaped semiconductor device intermediate product 1 is mounted on a guide rail 3 provided in front of and behind the machining position of a die 4 and intermittently fed by a feeding mechanism, and then the frame-shaped semiconductor device intermediate product 1 is punched out into a single-chip semiconductor device 5 with a stiffener. A slant 4a is provided in the die 4 and a taking-out chute 6 that follows the slant 4a is provided under the guide rail 3 in order to guide the punched-out single-chip semiconductor device 5 from the rear position of the machining position of the die to a position lower than the guide rail 3. COPYRIGHT: (C)2003,JPO