发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To realize a semiconductor device in which a recovery current change ratio dI/dt of a diode can be suppressed to a low value, only by processing to shorten a life time to the entirety of a cathode layer without necessity of aiming at a specific region of the cathode layer. SOLUTION: A thickness of the cathode layer 46 of a parasitic diode is set to 40μm or less, and a process for setting the life time of the layer 46 in the overall region to 10<SP>-6</SP>s or less is conducted. When the thickness of the layer 46 is set to 40μm or less, it is no longer necessary to locally conduct the process for shortening the life time, and the process for shortening the life time uniformly can be conducted for the entire cathode layer. The entirety can be applied to an element which is functioned as a transistor as a whole, in addition to a source region 54 and a gate electrode 60. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003209264(A) 申请公布日期 2003.07.25
申请号 JP20020003841 申请日期 2002.01.10
申请人 TOYOTA CENTRAL RES & DEV LAB INC;TOYOTA MOTOR CORP 发明人 KIGAMI MASAHITO;NISHIBE YUJI;UESUGI TSUTOMU;HAYASHI EIKO;HOSOKAWA HIDEKI;TAKATANI HIDESHI;HAMADA KIMIMORI;FUKAMI TAKESHI
分类号 H01L29/861;H01L27/04;H01L29/08;H01L29/78;(IPC1-7):H01L29/861 主分类号 H01L29/861
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